note: all specifications are subject to change without notice. 07 07-5 com express cpu modules features specifications COM-965 intel? core? 2 duo/ celeron? m (socket-p based) processors intel? gme965 + ich8m dual-channel ddr2 sodimm 533/667 memory, max. 4 gb gigabit ethernet crt, up to 24-bit dual-channel lvds lcd, sdvo high definition audio interface pata x 1, sata 3.0gb/s x 3 usb2.0 x 8 pci x 4, pci-express [x16] x 1, pci-express [x1] x 5 wide dc input range, +8.5v to +19v (optional) com express basic module pin-out type 2, com.0 rev. 1.0 com express cpu module with intel? core? 2 duo/ celeron? m (socket-p based) processors tf-COM-965-a10 ? com express cpu module, socket p, dual ddr2, gigabit ethernet, usb2.0, rev. a1.0 tf-COM-965-a10-01 ? com express cpu module, socket p, dual ddr2, gigabit ethernet, usb2.0, tpm, rev. a1.0 ordering information tf-ecb-916m-a10-01 ? com express carrier board, microatx, dual gigabit ethernet, 7.1ch audio, 4 com, usb, pci-express, at/atx, rev. a1.0 tf-per-a051 ? cpu cooler, for COM-965/com-45sp, socket-type cpu, 12v fan tf-per-a052 ? cpu cooler, for COM-965/com-45sp, onboard cpu, 12v fan tf-per-a082 ? passive heat-sink, for COM-965/com-45sp, socket-type cpu tf-per-a067 ? passive heat-sink, for COM-965/com-45sp, onboard cpu tf-per-a072 ? heat spreader kit, for COM-965/com-45sp, socket-type cpu tf-per-a066 ? heat spreader kit, for COM-965/com-45sp, onboard cpu optional accessories m2.5 screw x 5 ? product cd ? COM-965 ? packing list system form factor com express basic module, pin-out type 2, com.0 rev. 1.0 processor intel? core? 2 duo/ celeron? m (socket-p based) processors system memory 200-pin ddr2 sodimm x 2, max. 4 gb (ddr2 533/667), supports dual- channel function chipset intel? gme965 + ich8m i/o chipset ich8m ethernet intel? 82566mm, 10/100/1000base-tx tpm v1.2, infineon slb9635tt1.2 bios award bios v6.0 spi type, 2 mb rom eeprom atmel? at24c02, save bios and configuration data (optional) wake on lan yes watchdog timer fintek f75111 h/w status monitoring supports cpu temperature monitoring expansion interface pci-express [x16] x 1 (shared with 2 sdvo ports) pci-express [x1] x 5 32-bit pci x 4 lpc bus x 1 smbus x 1 i2c x 1 power requirement wide dc input range, +8.5v to +19v (optional) nominal: +12v 2-pin wafer for rtc battery power consumption (typical) intel? t7500 2.2ghz, ddr2 667 1 gb 3.7a @ +12v, 0.8a @ +5v (w/ecb-916m) board size 4.92(l) x 3.74"(w) (125mm x 95mm) gross weight 0.66 lb (0.3 kg) operating temperature 32 f ~ 140 f (0 c ~ 60 c) storage temperature -40 f ~ 176 f (-40 c ~ 80 c) operating humidity 0% ~ 90% relative humidity, non-condensing mtbf (hours) 100,000 display supports crt/lcd simultaneous/ dual view displays chipset intel? gme965 integrated memory shared system memory up to 384 mb/ dvmt 4.0 resolution up to 2048 x 1536 (qxga) @ 60 hz for crt up to 2048 x 1536 (qxga) for lcd lcd interface up to 24-bit dual-channel lvds sdvo/ dvo/ side port supports sdvo x 2 (shared with pci-express [x16]) i /o storage pata x 1 (two devices), sata 3.0gb/s x 3 usb usb2.0 x 8 audio high definition audio gpio up to 4 in or 4 out for wide temperature series of this model, please refer to chapter 1 - wide temperature boards, to get detailed specifcation of COM-965w1. dual-channel ddr2 sodimm fc-pga (socket p) 2-pin wafer for rtc battery ich8m intel ? 82566mm gigabit ethernet gme965
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